Sapphire wafer 2inch 4inch Single side Double side polish
Abstract
Our Sapphire Wafer, crafted from 99.999% pure Al2O3 monocrystal using the advanced Kyropoulos (KY) method, offers exceptional quality for semiconductor applications. Known
for its superior optical transparency, outstanding mechanical
strength, and excellent thermal stability, this sapphire material
is perfect for high-performance LEDs, laser diodes, and other electronic and
photonic devices. With precise thickness control and excellent surface quality, our
sapphire wafer ensures high reliability and efficiency in demanding
applications, making it the top choice for cutting-edge technology
solutions.
Compony Introduction
Our company, ZMSH, has been a prominent player in the semiconductor
industry for over a decade, boasting a professional team of factory experts and sales
personnel. We specialize in providing customized sapphire wafer
solutions, offering both tailored designs and OEM services to meet diverse
client needs. At ZMSH, we are committed to delivering products that excel in
both price and quality, ensuring customer satisfaction at every
stage. We invite you to contact us for more information or to
discuss your specific requirements.
Sapphire wafer Tecnical Parameters
| Properties | Target | Tolerance |
|
| Diameter | 50.8mm | ± 0.05mm |
| Thickness | 1000μm | ±15μm |
| Surface orientation of A plane | Off C-axis toM0.2° | ± 0.03° |
| Primary flat length | 16mm | ±1mm |
| Primary flat orientation | C-plane | ±0.1° |
| Back side Roughness | <0.3nm | |
| Front side Roughness | ≤0.3nm for DSP or 1.0±0.2um for SSP |
| Wafer edge | R-type |
| Total Thickness Variation, TTV | ≤ 10μm(LTV≤5μm,5*5) |
| Warp | ≤10μm |
| Bow | -8 μm ≤ BOW ≤ 0 |
| Laser Mark | N/A |
Sapphire wafer Applications
Sapphire wafers, crafted from single-crystal aluminum oxide
(Al₂O₃), are integral to various high-performance applications due
to their exceptional properties. Their unique characteristics
include remarkable hardness, optical transparency across a broad
spectrum (from ultraviolet to infrared), high thermal conductivity,
and excellent electrical insulation.
Key Applications of Sapphire Wafers:
- Semiconductor Substrates:
Silicon-on-Sapphire (SOS) Technology: Sapphire wafers serve as substrates for silicon-on-sapphire
integrated circuits, offering benefits like high-temperature
stability and radiation resistance.
Gallium Nitride (GaN) Device Fabrication: They provide a base for GaN-based devices, including blue and
ultraviolet LEDs, leveraging sapphire's insulating properties and
thermal conductivity.
Windows and Lenses: Sapphire's optical clarity and durability make it ideal for
windows and lenses in demanding environments, such as high-pressure
chambers and infrared optical systems.
Laser Components: Used in certain laser systems, sapphire's properties contribute to
efficient lasing and beam quality.
- Microelectromechanical Systems (MEMS):
Structural Components: The mechanical strength of sapphire wafers supports MEMS devices,
including accelerometers and gyroscopes, enhancing their
performance and reliability.
- Optoelectronic Applications:
Photonics Platforms: Sapphire substrates are utilized in photonic devices, benefiting
from their low optical loss and compatibility with various laser
gain media.
Protective Windows: Due to their hardness and optical properties, sapphire is used in
transparent armor applications, providing protection while
maintaining optical clarity.
The versatility of sapphire wafers across these applications
underscores their importance in advancing technology that demands
durability, transparency, and high performance.
Product Display - ZMSH
- 2 inch double side polish sapphire wafer
- 4 inch single side polish sapphire wafer
Sapphire wafer FAQ
Q: How to make a sapphire wafer?
A: Sapphire wafers are fabricated by slicing high-purity sapphire
crystal boules into thin discs. The process involves:
- Orientation: Precisely aligning the crystal on the slicing machine.
- Slicing: Cutting the crystal into thin wafers.
- Grinding: Removing slicing damage and improving flatness.
- Chamfering: Beveling edges to enhance mechanical strength.
- Polishing: Achieving a smooth, precise surface finish.
- Cleaning: Eliminating surface contaminants.
- Quality Inspection: Ensuring wafers meet specified standards.
Q: How to cut a sapphire wafer?
A: Cutting sapphire wafers requires specialized techniques due to
sapphire's hardness and brittleness. Common methods include:
- Laser Scribing and Cleaving: Ultraviolet lasers create precise scribe lines, which are then
cleaved mechanically, minimizing chipping and preserving device
integrity.
- Mechanical Dicing: Diamond-embedded blades saw through the wafer, though this can
cause chipping and may require additional polishing.
Q: What size are sapphire wafers?
A: Sapphire wafers are available in various diameters, commonly
ranging from 2 inches (50.8 mm) to 12 inches (300 mm). Standard
sizes include 2-inch, 4-inch, 6-inch, 8-inch, and 12-inch wafers.
Larger diameters, such as 8-inch and 12-inch wafers, are
increasingly utilized to enhance productivity and reduce costs in
semiconductor manufacturing.
