Product Overview
The equipment combines ultra-fast picosecond laser technology with
intelligent control systems, designed for high-value material
precision processing. Key advantages include:
- Picosecond-level Ultra-fast Processing: 1064nm wavelength pulsed laser with energy levels adjustable from
0.1mJ to 5mJ (step size 0.1mJ), delivering pulse durations
<10^-12 seconds. This minimizes thermal damage (<10μm
heat-affected zone) and eliminates micro-cracking.
- Full Digital Closed-loop Control: Equipped with industrial-grade PCs and proprietary LaserMaster
Pro software, supporting G-code programming, CAD auto-conversion,
and real-time path optimization. Positioning accuracy reaches
±0.005mm.
- 4-Axis Intelligent System: XYZ axes with ±0.002mm repeatability and optional C-axis rotation
enable complex multi-tasking for irregular hole patterns.
Typical Applications:
- Semiconductor industry: Wafer drilling, micro-structure fabrication
- Ultra-hard materials: Diamond tooling,apphire optical component
micro-drilling
- Biomedical field: Artificial joints, dental implants precision
drilling
- New energy sector: Lithium-ion battery micro-porous array
processing
Processing Performance & Quality Assurance 
. Exceptional Processing Capabilities
- Micro-drilling: Minimum aperture φ0.5μm, depth-to-diameter ratio up to 1:50 (no
chipping in hard materials)
- Complex Structures: Supports conical holes (0.1°–5° adjustable), spiral grooves, and
multi-stage holes in one process
- Non-destructive Cutting: Ideal for thin films (e.g., PI film, graphene) with sub-micron
precision
. End-to-End Quality Management
- Smart Compensation: Real-time monitoring of laser power fluctuations and thermal
deformation with dynamic parameter adjustments
- Process Database: Pre-built parameters for over 200 materials (metals, ceramics,
gemstones, composites)
- In-line Inspection: Automated generation of hole size distribution maps and surface
roughness analysis reports (Ra ≤0.8μm)
Material Compatibility Test Results
| Material Type | Typical Processing Outcome |
|---|
| Polycrystalline Diamond (PCD) | φ2μm holes with smooth edges/no burrs |
| 18K Gold | Sub-micron hollow patterns without oxidation |
| Tungsten Carbide (WC) | Diameter tolerance ±1.5%, depth-to-diameter ratio 1:30 |
| Bio-Glass | Low thermal stress drilling, >95% cell viability |
ZMSH Pico-precision Laser Drilling Machine Result Processsing
Ca'pability
This laser drilling machine, with its exceptional precision and
high efficiency, is widely used for high-precision processing needs
across various industries. Its core advantage lies in the
micron-level hole drilling capability and versatile processing
modes, allowing it to meet stringent quality requirements in
multiple sectors.
Micro-hole Drilling Capability
The machine is capable of drilling micro-holes as small as 0.005mm,
ensuring precise drilling even in the most delicate areas of
materials with virtually no heat-affected zone. Even when working
with harder materials like polycrystalline diamond, the holes
remain smooth with no burrs or cracking, and the depth-to-diameter
ratio can reach 1:50, significantly enhancing processing efficiency
and material utilization.
Complex Structure Processing
The laser drilling machine supports the processing of complex
geometries, such as conical holes (adjustable from 0.1°–5°), spiral
grooves, and multi-stage holes in a single operation. This reduces
the need for multiple processes, saving both time and cost.
Additionally, the machine’s three-axis precision worktable and
high-precision air-floating rotation system ensure accurate
positioning and stable control during processing.
Non-destructive Cutting
For ultra-thin materials such as PI film and graphene, the machine
exhibits high precision and non-destructive cutting capabilities.
The ultra-short pulse duration of the laser minimizes heat
conduction, preventing damage to sensitive materials and ensuring
the integrity and smoothness of the material surface.
Multi-material Compatibility
The machine is compatible with various materials, including metals,
ceramics, gemstones, and composites. During the processing of
different materials, the machine’s intelligent energy adjustment
system automatically adjusts the laser power according to the
material's properties, ensuring optimal results for each material.
Moreover, the real-time monitoring system effectively controls
fluctuations in laser power and thermal deformation, guaranteeing
stability and consistency throughout the processing.
ZMSH Pico-precision Laser Drilling Machine
FAQs
Q: Is the equipment commissioning time-consuming?
A: Pre-installed parameter packages enable 30-minute basic
functional verification. Remote guidance by our team can further
reduce setup time to 2 hours.
Q: How to handle multi-material sequential cutting?
A: Supports multi-layer processing modes with automatic tool change
and parameter switching between materials like stainless steel and
ceramics.
