Automated Precision Dicing Machine
High-Performance Solutions for Semiconductor, Electronics, and
Precision Manufacturing
The Automated Precision Dicing Machine is designed for
ultra-precision cutting of brittle materials such as
semiconductors, ceramics, glass, and composites. Engineered with
dual-spindle technology, multi-axis control, and fully automated
systems, this machine delivers unmatched accuracy and efficiency
for applications like wafer dicing, FPC flexible board cutting, and
micro-component processing.
Key Applications:
- Semiconductor wafer slicing
- Ceramic substrate division
- Medical device manufacturing
- Automotive electronics
- Optical component processing
Core Advantages:
- Dual-spindle configuration for flexible power options
(1.2/1.8/2.4/3.0 kW) and ultra-high-speed cutting (up to 60,000
RPM).
- Multi-axis synchronization (Y1/Y2, X, Z1/Z2, O axes) ensures
sub-micron precision and complex geometry handling.
- Fully automated cleaning system for zero-defect production.
Technical Specifications
| Parameter | Value |
|---|
| Working Size | Φ8″, Φ12″ |
| Main Spindle | Dual Power: 1.2/1.8/2.4/3.0 kW; Max Speed: 60,000 RPM |
| Tool Size | 2″–3″ |
| Y1/Y2 Axis | Repeatability: ±0.0001 mm; Travel Range: <0.002 mm; Speed: 310
mm/s |
| X Axis | Speed: 0–600 mm/s; Repeatability: ±0.001 mm |
| Z1/Z2 Axis | Repeatability: ±0.002 mm; Travel Range: 0–600 mm/s |
| O Axis | Rotation Angle: ±15°; Repeatability: ±0.001 mm |
| Cleaning Table | Speed: 100–300 RPM; Fully Automatic Washing System |
| Working Voltage | 3-Phase 380V, 50 Hz |
| Dimensions (L×W×H) | 1550 × 1255 × 1880 mm |
| Weight | 2100 kg |
Performance & Quality of Dicing Machine
Precision Engineering
- Achieves ±0.0001 mm repeatability on Y1/Y2 axes and ±0.002 mm on Z1/Z2 axes, ensuring consistent edge quality with minimal chipping or
micro-cracks.
- Advanced vision systems and force feedback adapt to material
deformation and tool wear.
Speed & Efficiency
- High-speed spindle (60,000 RPM) combined with 310 mm/s linear axis
movement maximizes throughput without compromising accuracy.
- Automated loading/unloading and cleaning reduce cycle time by 30%.
Durability
- Robust construction with vibration-resistant design ensures 24/7
operation.
- Spindle life optimized for 8,000+ hours under continuous use.
Application
- Semiconductor: Wafer dicing for chips down to 50μm thickness.
- Medical Devices: Precision cutting of bio-compatible materials (e.g., alumina
ceramics).
- Automotive: Flexible PCB and sensor component singulation.
ZMSH Automated Precision Dicing Machine
Frequently Asked Questions (FAQ)
Q: What materials can this machine handle?
A: It’s designed for cutting brittle materials like semiconductors,
ceramics, glass, and composites. Common uses include slicing
wafers, processing flexible printed circuits (FPC), and precision
components for electronics or medical devices.
Q: How precise is the machine?
A: It achieves extremely fine cuts with accuracy down to 0.0001 mm
(thinner than a human hair). This ensures clean edges with minimal
chipping, even for delicate materials.
Q: What power does it need?
A: It runs on standard 3-phase 380V power (common in industrial
settings). The dual-spindle system adapts to different materials by
adjusting power output.
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