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4inch Sapphire Wafer 200um Thickness C Axis Highly Applied for Semiconductor

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    Buy cheap 4inch Sapphire Wafer 200um Thickness C Axis Highly Applied for Semiconductor from wholesalers
     
    Buy cheap 4inch Sapphire Wafer 200um Thickness C Axis Highly Applied for Semiconductor from wholesalers
    • Buy cheap 4inch Sapphire Wafer 200um Thickness C Axis Highly Applied for Semiconductor from wholesalers
    • Buy cheap 4inch Sapphire Wafer 200um Thickness C Axis Highly Applied for Semiconductor from wholesalers
    • Buy cheap 4inch Sapphire Wafer 200um Thickness C Axis Highly Applied for Semiconductor from wholesalers
    • Buy cheap 4inch Sapphire Wafer 200um Thickness C Axis Highly Applied for Semiconductor from wholesalers
    • Buy cheap 4inch Sapphire Wafer 200um Thickness C Axis Highly Applied for Semiconductor from wholesalers

    4inch Sapphire Wafer 200um Thickness C Axis Highly Applied for Semiconductor

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    Brand Name : ZMSH
    Model Number : 4inch Sapphire Wafer
    Certification : RoHS
    Payment Terms : T/T
    Delivery Time : 2-4weeks
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    4inch Sapphire Wafer 200um Thickness C Axis Highly Applied for Semiconductor

    4inch Sapphire Wafer 200um Thickness C Axis Highly Applied for Semiconductor


    Product Description:


    Sapphire wafers are composed of aluminum oxide (Al₂O₃), in which three oxygen atoms are covalently bonded to two aluminum atoms. They exhibit a hexagonal lattice crystal structure and are commonly cut along the A-plane, C-plane, and R-plane orientations. Owing to their broad optical transparency range, sapphire wafers transmit light from the near-ultraviolet (190 nm) to the mid-infrared wavelengths, making them an ideal choice for optical components, infrared devices, high-power laser windows, and photomask materials. Sapphire wafers are renowned for their high acoustic velocity, high-temperature resistance, corrosion resistance, high hardness, excellent transparency, and high melting point (2045°C). They are a challenging material to process, but are widely used in optoelectronic devices.


    Product Parameters:


    Diameter:4inch or 100±0.1mm
    Thickness:200±15um500 ± 15 um,650±15um;
    Roughness:Ra ≤ 0.2 nm
    Warp:≤ 10um
    TTV:≤ 10um
    Polish:DSP (Double Side Polished); SSP(Single Side Polished)
    Shape:Round, Flat, Notch
    Wafer Orientation:C Axis
    Edge Form:45°, C shape
    Material:Sapphire
    Remarks:All specifications above can be customized upon your request.

    Product Pictures:



    Product Highlights:


    * Sapphire wafers are with common crystallographic orientations include C‑plane (0001), A‑plane (11‑20), and R‑plane (1‑102); the choice of orientation tailors optical, mechanical, and epitaxial behavior for specific devices.


    * Typical optical transmission spans the near‑UV to mid‑infrared (approximately 0.19–5.5 μm), with high transparency in the 0.3–5 μm range, supporting applications in optics and optoelectronics.


    * Mechanical and thermal properties of sapphire wafers include a Mohs hardness of 9, high strength and wear resistance, and a melting point ~2050°C, enabling performance under extreme environments.


    * Chemical stability of sapphire wafers is excellent—resistant to most acids and alkalis—with notable attack only by HF, phosphoric acid, and molten KOH at elevated temperatures.


    * Representative applications of sapphire wafers: LED substrates (GaN on sapphire), infrared and laser windows, optical components, and wear‑resistant covers in consumer electronics.


    Related Product Recommendation:


    150mm 6 Inch Sapphire Substrate Al2O3 DSP Ssp 1.0mmt For Led PSS Customized


    Q&A:


    Q: What is a sapphire wafer?


    A: A sapphire wafer is a circular thin slice made of sapphire material, which is widely used in the manufacturing of semiconductors and optical devices.


    Q: What size are sapphire wafers?


    A: 2inch, 3inch, 4inch, 6inch, 8inch, 12inch.


    Q: How to cut a sapphire wafer?


    A: Cutting a sapphire wafer requires specialized methods due to its extreme hardness (9 on the Mohs scale, second only to diamond) and brittleness. The core approach relies on abrasive-based or laser-based techniques to achieve precise, low-damage cuts.



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